PCB_Produktion_Quick

Printed Circuit Board (PCB)
Service ydelser:	Firma profil:
Quick Service Prototyper, Lav / Medium vol. Dobbeltsidet print Multilagsprint 4 til 30 Lag	Ca 516 ansatte Fabiksareal 3000 m ²
Kababilitet :	Kvalitetsstandarder:
Min. print tyk. 0,2mm. Max 3mm Min. kobber tyk. 0.5OZ. Max 4OZ Min. hul diameter ø0,25 Min. Trace 0,1 mm	ISO 9001:2000 ISO 14001 QS 9000 Normer: UL, CSA
Min Ordre (MOQ):	Prisniveau:
Min 5 Stk. (For kunder)	Under 30-40% af dansk pris.

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Principle Products

        ·Express PCB
        ·Multilayer PCB(2-30 Layer)
        ·High Frequency Board
        ·Flexible Printing Board
        ·Blind/Buried Hole Board
        ·High Tg Thick Copper PCB
      ·Metal Core Board
      ·Metal Base Board(AI, Cu, Fe)
        ·Mix-Material Multilayer PCB
        ·Flat Winding Multilayer PCB
        ·Embedding Resistance/Capacitance Board
        ·Flexi-rigid Printed Board
        ·Halogen-ree/Lead-free Board
        ·Thick Gold Plating/Immersion Gold Board

Capacity

·Double Side 60000M2/Year
·Multilayer 50000M2/Year

Factory Area

·3000M2

Number of Employees

·516Person

Base Material

        ·Epoxy Fiber Glass Laminate FR4
        ·High Frequency  PTFE Base Material Supply By
         Rogers、Taconic etc.
        ·Aluminum Base Copper Clad Material Supply By
         Bergquist etc.

Soldermask

·Liquid Photo Imageable S/M

Plating Finishes

        ·Hot Air Leveling
        ·Flash Gold
        ·Gold Finger
        ·Electroless Gold Plating
        ·OSP
        ·HAL
        ·Lead free HAL

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Item	Production	Prototype
Max Layer Count	18	26
Max Board Thickness	0.175¡±	0.200¡±
Min Board Thickness	0.014¡±	0.012¡±
Drill to Metal	0.008¡±	0.007¡±
Innerlayer Registration	+/- 0.003¡±	+/- 0.003¡±
Line Width/Spacing, Outer/Inner (17 micron)	0.003¡± / 0.003¡±	0.003¡± / 0.003¡±
Aspect Ratio	</= 8:1	</= 12:1
Min QFP Pitch (not HASL)	0.016¡±	0.010¡±
Controlled Impedance(Single ended) (Differential)	50 - 90 ohms +/- 8%* 100 - 155 ohms +/- 10%*	50 - 90 ohms +/- 7%* 100 - 155 ohms +/- 8%*
Max Internal Copper Wt.	6 oz	6 oz
HDI(1+N+1 Max Layer Count) -Min Via Size - Min Capture Pad Size	0.004¡± 0.012¡±	0.004¡± 0.012¡±

* Less than 10% impedance tolerance capability is design dependent.

High Performance materials	Production	Prototype
Bismalemide Triazine (BT) or equivalent	Yes	Yes
Nelco N - 4000 - 13 (SI)	Yes	Yes
Nelco N - 4000 - 13	Yes	Yes
Getek / Megtron	Yes	Yes
Rogers 4350	Yes	Yes
Rogers 3003/3006	Yes	Yes
Taconic RF35	Yes	Yes
Hitachi MCL-BE-67G	Yes	Yes
Polyclad PCL-FR370HR

Flexible board

Embedded system

Backboard

Thick gold board

PCB with gold fingers

HDI board for mobile phone

PTF & Blind vias board

High TG Module

Ceramic board

Winding\Minisize Module

High Frequency,Blind vias,Thick gold

Telecommunication

Double side board

Half vias board

Memory Bank

Mix-material High Frequency

System Integration

Power Module

High Frequency

O-E Module